1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7	bool "Thermal drivers"
8	help
9	  Thermal drivers offer a generic mechanism for
10	  thermal management. Usually it's made up of one or more thermal
11	  zones and cooling devices.
12	  Each thermal zone contains its own temperature, trip points,
13	  and cooling devices.
14	  All platforms with ACPI or Open Firmware thermal support can use
15	  this driver.
16	  If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21	bool "Thermal netlink management"
22	depends on NET
23	help
24	  The thermal framework has a netlink interface to do thermal
25	  zones discovery, temperature readings and events such as
26	  trip point crossed, cooling device update or governor
27	  change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30	bool "Thermal state transition statistics"
31	help
32	  Export thermal state transition statistics information through sysfs.
33
34	  If in doubt, say N.
35
36config THERMAL_DEBUGFS
37	bool "Thermal subsystem debug support"
38	depends on DEBUG_FS
39	help
40	  Say Y to allow the thermal subsystem to collect diagnostic
41	  information that can be accessed via debugfs.
42
43config THERMAL_CORE_TESTING
44	tristate "Thermal core testing facility"
45	depends on DEBUG_FS
46	help
47	  Say Y to add a debugfs-based thermal core testing facility.
48	  It allows test thermal zones to be created and populated
49	  with trip points in order to exercise the thermal core
50	  functionality in a controlled way.
51
52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
53	int "Emergency poweroff delay in milli-seconds"
54	default 0
55	help
56	  Thermal subsystem will issue a graceful shutdown when
57	  critical temperatures are reached using orderly_poweroff(). In
58	  case of failure of an orderly_poweroff(), the thermal emergency
59	  poweroff kicks in after a delay has elapsed and shuts down the system.
60	  This config is number of milliseconds to delay before emergency
61	  poweroff kicks in. Similarly to the critical trip point,
62	  the delay should be carefully profiled so as to give adequate
63	  time for orderly_poweroff() to finish on regular execution.
64	  If set to 0 emergency poweroff will not be supported.
65
66	  In doubt, leave as 0.
67
68config THERMAL_HWMON
69	bool
70	prompt "Expose thermal sensors as hwmon device"
71	depends on HWMON=y || HWMON=THERMAL
72	default y
73	help
74	  In case a sensor is registered with the thermal
75	  framework, this option will also register it
76	  as a hwmon. The sensor will then have the common
77	  hwmon sysfs interface.
78
79	  Say 'Y' here if you want all thermal sensors to
80	  have hwmon sysfs interface too.
81
82config THERMAL_OF
83	bool
84	prompt "APIs to parse thermal data out of device tree"
85	depends on OF
86	default y
87	help
88	  This options provides helpers to add the support to
89	  read and parse thermal data definitions out of the
90	  device tree blob.
91
92	  Say 'Y' here if you need to build thermal infrastructure
93	  based on device tree.
94
95choice
96	prompt "Default Thermal governor"
97	default THERMAL_DEFAULT_GOV_STEP_WISE
98	help
99	  This option sets which thermal governor shall be loaded at
100	  startup. If in doubt, select 'step_wise'.
101
102config THERMAL_DEFAULT_GOV_STEP_WISE
103	bool "step_wise"
104	select THERMAL_GOV_STEP_WISE
105	help
106	  Use the step_wise governor as default. This throttles the
107	  devices one step at a time.
108
109config THERMAL_DEFAULT_GOV_FAIR_SHARE
110	bool "fair_share"
111	select THERMAL_GOV_FAIR_SHARE
112	help
113	  Use the fair_share governor as default. This throttles the
114	  devices based on their 'contribution' to a zone. The
115	  contribution should be provided through platform data.
116
117config THERMAL_DEFAULT_GOV_USER_SPACE
118	bool "user_space"
119	select THERMAL_GOV_USER_SPACE
120	help
121	  The Userspace governor allows to get trip point crossed
122	  notification from the kernel via uevents. It is recommended
123	  to use the netlink interface instead which gives richer
124	  information about the thermal framework events.
125
126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
127	bool "power_allocator"
128	depends on THERMAL_GOV_POWER_ALLOCATOR
129	help
130	  Select this if you want to control temperature based on
131	  system and device power allocation. This governor can only
132	  operate on cooling devices that implement the power API.
133
134config THERMAL_DEFAULT_GOV_BANG_BANG
135	bool "bang_bang"
136	depends on THERMAL_GOV_BANG_BANG
137	help
138	  Use the bang_bang governor as default. This throttles the
139	  devices one step at the time, taking into account the trip
140	  point hysteresis.
141
142endchoice
143
144config THERMAL_GOV_FAIR_SHARE
145	bool "Fair-share thermal governor"
146	help
147	  Enable this to manage platform thermals using fair-share governor.
148
149config THERMAL_GOV_STEP_WISE
150	bool "Step_wise thermal governor"
151	help
152	  Enable this to manage platform thermals using a simple linear
153	  governor.
154
155config THERMAL_GOV_BANG_BANG
156	bool "Bang Bang thermal governor"
157	default n
158	help
159	  Enable this to manage platform thermals using bang bang governor.
160
161	  Say 'Y' here if you want to use two point temperature regulation
162	  used for fans without throttling.  Some fan drivers depend on this
163	  governor to be enabled (e.g. acerhdf).
164
165config THERMAL_GOV_USER_SPACE
166	bool "User_space thermal governor"
167	help
168	  Enable this to let the user space manage the platform thermals.
169
170config THERMAL_GOV_POWER_ALLOCATOR
171	bool "Power allocator thermal governor"
172	depends on ENERGY_MODEL
173	help
174	  Enable this to manage platform thermals by dynamically
175	  allocating and limiting power to devices.
176
177config CPU_THERMAL
178	bool "Generic cpu cooling support"
179	depends on THERMAL_OF
180	help
181	  Enable the CPU cooling features. If the system has no active
182	  cooling device available, this option allows to use the CPU
183	  as a cooling device.
184
185if CPU_THERMAL
186
187config CPU_FREQ_THERMAL
188	bool "CPU frequency cooling device"
189	depends on CPU_FREQ
190	default y
191	help
192	  This implements the generic cpu cooling mechanism through frequency
193	  reduction. An ACPI version of this already exists
194	  (drivers/acpi/processor_thermal.c).
195	  This will be useful for platforms using the generic thermal interface
196	  and not the ACPI interface.
197
198config CPU_IDLE_THERMAL
199	bool "CPU idle cooling device"
200	depends on IDLE_INJECT
201	help
202	  This implements the CPU cooling mechanism through
203	  idle injection. This will throttle the CPU by injecting
204	  idle cycle.
205endif
206
207config DEVFREQ_THERMAL
208	bool "Generic device cooling support"
209	depends on PM_DEVFREQ
210	depends on PM_OPP
211	help
212	  This implements the generic devfreq cooling mechanism through
213	  frequency reduction for devices using devfreq.
214
215	  This will throttle the device by limiting the maximum allowed DVFS
216	  frequency corresponding to the cooling level.
217
218	  In order to use the power extensions of the cooling device,
219	  devfreq should use the simple_ondemand governor.
220
221	  If you want this support, you should say Y here.
222
223config PCIE_THERMAL
224	bool "PCIe cooling support"
225	depends on PCIEPORTBUS
226	help
227	  This implements PCIe cooling mechanism through bandwidth reduction
228	  for PCIe devices.
229
230	  If you want this support, you should say Y here.
231
232config THERMAL_EMULATION
233	bool "Thermal emulation mode support"
234	help
235	  Enable this option to make a emul_temp sysfs node in thermal zone
236	  directory to support temperature emulation. With emulation sysfs node,
237	  user can manually input temperature and test the different trip
238	  threshold behaviour for simulation purpose.
239
240	  WARNING: Be careful while enabling this option on production systems,
241	  because userland can easily disable the thermal policy by simply
242	  flooding this sysfs node with low temperature values.
243
244config THERMAL_MMIO
245	tristate "Generic Thermal MMIO driver"
246	depends on OF
247	depends on HAS_IOMEM
248	help
249	  This option enables the generic thermal MMIO driver that will use
250	  memory-mapped reads to get the temperature.  Any HW/System that
251	  allows temperature reading by a single memory-mapped reading, be it
252	  register or shared memory, is a potential candidate to work with this
253	  driver.
254
255config HISI_THERMAL
256	tristate "Hisilicon thermal driver"
257	depends on ARCH_HISI || COMPILE_TEST
258	depends on HAS_IOMEM
259	depends on OF
260	default ARCH_HISI
261	help
262	  Enable this to plug hisilicon's thermal sensor driver into the Linux
263	  thermal framework. cpufreq is used as the cooling device to throttle
264	  CPUs when the passive trip is crossed.
265
266config IMX_THERMAL
267	tristate "Temperature sensor driver for Freescale i.MX SoCs"
268	depends on ARCH_MXC || COMPILE_TEST
269	depends on NVMEM || !NVMEM
270	depends on MFD_SYSCON
271	depends on OF
272	help
273	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
274	  It supports one critical trip point and one passive trip point.  The
275	  cpufreq is used as the cooling device to throttle CPUs when the
276	  passive trip is crossed.
277
278config IMX_SC_THERMAL
279	tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
280	depends on IMX_SCU
281	depends on OF
282	help
283	  Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
284	  system controller inside, Linux kernel has to communicate with system
285	  controller via MU (message unit) IPC to get temperature from thermal
286	  sensor. It supports one critical trip point and one
287	  passive trip point for each thermal sensor.
288
289config IMX8MM_THERMAL
290	tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
291	depends on ARCH_MXC || COMPILE_TEST
292	depends on OF
293	help
294	  Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
295	  It supports one critical trip point and one passive trip point. The
296	  cpufreq is used as the cooling device to throttle CPUs when the passive
297	  trip is crossed.
298
299config K3_THERMAL
300	tristate "Texas Instruments K3 thermal support"
301	depends on ARCH_K3 || COMPILE_TEST
302	help
303	  If you say yes here you get thermal support for the Texas Instruments
304	  K3 SoC family. The current chip supported is:
305	  - AM654
306
307	  This includes temperature reading functionality.
308
309config MAX77620_THERMAL
310	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
311	depends on MFD_MAX77620
312	depends on OF
313	help
314	  Support for die junction temperature warning alarm for Maxim
315	  Semiconductor PMIC MAX77620 device. Device generates two alarm
316	  interrupts when PMIC die temperature cross the threshold of
317	  120 degC and 140 degC.
318
319config QORIQ_THERMAL
320	tristate "QorIQ Thermal Monitoring Unit"
321	depends on THERMAL_OF && HAS_IOMEM
322	depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
323	select REGMAP_MMIO
324	help
325	  Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
326	  It supports one critical trip point and one passive trip point. The
327	  cpufreq is used as the cooling device to throttle CPUs when the
328	  passive trip is crossed.
329
330config AIROHA_THERMAL
331	tristate "Airoha thermal sensor driver"
332	depends on ARCH_AIROHA || COMPILE_TEST
333	depends on MFD_SYSCON
334	depends on OF
335	help
336	  Enable this to plug the Airoha thermal sensor driver into the Linux
337	  thermal framework.
338
339config SPEAR_THERMAL
340	tristate "SPEAr thermal sensor driver"
341	depends on PLAT_SPEAR || COMPILE_TEST
342	depends on HAS_IOMEM
343	depends on OF
344	help
345	  Enable this to plug the SPEAr thermal sensor driver into the Linux
346	  thermal framework.
347
348config SUN8I_THERMAL
349	tristate "Allwinner sun8i thermal driver"
350	depends on ARCH_SUNXI || COMPILE_TEST
351	depends on HAS_IOMEM
352	depends on NVMEM
353	depends on OF
354	depends on RESET_CONTROLLER
355	help
356	  Support for the sun8i thermal sensor driver into the Linux thermal
357	  framework.
358
359	  To compile this driver as a module, choose M here: the
360	  module will be called sun8i-thermal.
361
362config ROCKCHIP_THERMAL
363	tristate "Rockchip thermal driver"
364	depends on ARCH_ROCKCHIP || COMPILE_TEST
365	depends on RESET_CONTROLLER
366	depends on HAS_IOMEM
367	help
368	  Rockchip thermal driver provides support for Temperature sensor
369	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
370	  trip point. Cpufreq is used as the cooling device and will throttle
371	  CPUs when the Temperature crosses the passive trip point.
372
373config KIRKWOOD_THERMAL
374	tristate "Temperature sensor on Marvell Kirkwood SoCs"
375	depends on MACH_KIRKWOOD || COMPILE_TEST
376	depends on HAS_IOMEM
377	depends on OF
378	help
379	  Support for the Kirkwood thermal sensor driver into the Linux thermal
380	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
381
382config DOVE_THERMAL
383	tristate "Temperature sensor on Marvell Dove SoCs"
384	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
385	depends on HAS_IOMEM
386	depends on OF
387	help
388	  Support for the Dove thermal sensor driver in the Linux thermal
389	  framework.
390
391config DB8500_THERMAL
392	tristate "DB8500 thermal management"
393	depends on MFD_DB8500_PRCMU && OF
394	default y
395	help
396	  Adds DB8500 thermal management implementation according to the thermal
397	  management framework. A thermal zone with several trip points will be
398	  created. Cooling devices can be bound to the trip points to cool this
399	  thermal zone if trip points reached.
400
401config ARMADA_THERMAL
402	tristate "Marvell EBU Armada SoCs thermal management"
403	depends on ARCH_MVEBU || COMPILE_TEST
404	depends on HAS_IOMEM
405	depends on OF
406	help
407	  Enable this option if you want to have support for thermal management
408	  controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
409
410config DA9062_THERMAL
411	tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
412	depends on MFD_DA9062 || COMPILE_TEST
413	depends on OF
414	help
415	  Enable this for the Dialog Semiconductor thermal sensor driver.
416	  This will report PMIC junction over-temperature for one thermal trip
417	  zone.
418	  Compatible with the DA9062 and DA9061 PMICs.
419
420menu "Mediatek thermal drivers"
421depends on ARCH_MEDIATEK || COMPILE_TEST
422source "drivers/thermal/mediatek/Kconfig"
423endmenu
424
425config AMLOGIC_THERMAL
426	tristate "Amlogic Thermal Support"
427	default ARCH_MESON
428	depends on OF && ARCH_MESON
429	help
430	  If you say yes here you get support for Amlogic Thermal
431	  for G12 SoC Family.
432
433	  This driver can also be built as a module. If so, the module will
434	  be called amlogic_thermal.
435
436menu "Intel thermal drivers"
437depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
438source "drivers/thermal/intel/Kconfig"
439endmenu
440
441menu "Broadcom thermal drivers"
442depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
443		COMPILE_TEST
444source "drivers/thermal/broadcom/Kconfig"
445endmenu
446
447menu "Texas Instruments thermal drivers"
448depends on ARCH_HAS_BANDGAP || COMPILE_TEST
449depends on HAS_IOMEM
450source "drivers/thermal/ti-soc-thermal/Kconfig"
451endmenu
452
453menu "Samsung thermal drivers"
454depends on ARCH_EXYNOS || COMPILE_TEST
455source "drivers/thermal/samsung/Kconfig"
456endmenu
457
458menu "STMicroelectronics thermal drivers"
459depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
460source "drivers/thermal/st/Kconfig"
461endmenu
462
463source "drivers/thermal/renesas/Kconfig"
464
465source "drivers/thermal/tegra/Kconfig"
466
467config GENERIC_ADC_THERMAL
468	tristate "Generic ADC based thermal sensor"
469	depends on IIO
470	help
471	  This enabled a thermal sysfs driver for the temperature sensor
472	  which is connected to the General Purpose ADC. The ADC channel
473	  is read via IIO framework and the channel information is provided
474	  to this driver. This driver reports the temperature by reading ADC
475	  channel and converts it to temperature based on lookup table.
476
477menu "Qualcomm thermal drivers"
478depends on (ARCH_QCOM && OF) || COMPILE_TEST
479source "drivers/thermal/qcom/Kconfig"
480endmenu
481
482config UNIPHIER_THERMAL
483	tristate "Socionext UniPhier thermal driver"
484	depends on ARCH_UNIPHIER || COMPILE_TEST
485	depends on THERMAL_OF && MFD_SYSCON
486	help
487	  Enable this to plug in UniPhier on-chip PVT thermal driver into the
488	  thermal framework. The driver supports CPU thermal zone temperature
489	  reporting and a couple of trip points.
490
491config SPRD_THERMAL
492	tristate "Temperature sensor on Spreadtrum SoCs"
493	depends on ARCH_SPRD || COMPILE_TEST
494	help
495	  Support for the Spreadtrum thermal sensor driver in the Linux thermal
496	  framework.
497
498config KHADAS_MCU_FAN_THERMAL
499	tristate "Khadas MCU controller FAN cooling support"
500	depends on OF
501	depends on MFD_KHADAS_MCU
502	select MFD_CORE
503	select REGMAP
504	help
505	  If you say yes here you get support for the FAN controlled
506	  by the Microcontroller found on the Khadas VIM boards.
507
508config LOONGSON2_THERMAL
509	tristate "Loongson-2 SoC series thermal driver"
510	depends on LOONGARCH || COMPILE_TEST
511	depends on OF
512	help
513	  Support for Thermal driver found on Loongson-2 SoC series platforms.
514	  The thermal driver realizes get_temp and set_trips function, which
515	  are used to obtain the temperature of the current node and set the
516	  temperature range to trigger the interrupt. When the input temperature
517	  is higher than the high temperature threshold or lower than the low
518	  temperature threshold, the interrupt will occur.
519
520endif
521