| /linux/Documentation/devicetree/bindings/rtc/ |
| H A D | epson,rtc7301.yaml | 10 The only difference between the two variants is the packaging.
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| /linux/Documentation/devicetree/bindings/iio/light/ |
| H A D | ti,opt4001.yaml | 14 Last part of compatible is for the packaging used.
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| /linux/drivers/iio/light/ |
| H A D | opt4001.c | 74 * The different packaging of OPT4001 has different constants used when calculating
438 * opt4001 packaging
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| /linux/tools/testing/selftests/hid/tests/ |
| H A D | conftest.py | 8 from packaging.version import Version
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| /linux/drivers/net/ethernet/sfc/ |
| H A D | fw_formats.h | 23 * Besides, some packaging formats (such as CMS/PKCS#7 signed images)
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| H A D | efx_reflash.c | 220 /* Some packaging formats (such as CMS/PKCS#7 signed images) in efx_reflash_parse_firmware_data()
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| /linux/arch/sparc/ |
| H A D | Makefile | 82 # This is the image used for packaging
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| /linux/Documentation/bpf/ |
| H A D | bpf_licensing.rst | 87 Packaging BPF programs with user space applications
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| /linux/Documentation/devicetree/bindings/pinctrl/ |
| H A D | pinmux-node.yaml | 48 different pins and functions depending on the SoC revision and packaging.
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| /linux/Documentation/dev-tools/ |
| H A D | kselftest.rst | 203 Packaging selftests
206 In some cases packaging is desired, such as when tests need to run on a
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| /linux/tools/docs/ |
| H A D | test_doc_build.py | 63 "packaging": "20.4",
85 "packaging": "25.0",
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| /linux/arch/arm/mach-bcm/ |
| H A D | Kconfig | 179 The base chip is BCM53573 and there are some packaging modifications
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| /linux/Documentation/hwmon/ |
| H A D | max31827.rst | 48 MAX31827 implements a temperature sensor with a 6 WLP packaging scheme. This
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| /linux/arch/s390/ |
| H A D | Makefile | 129 #KBUILD_IMAGE is necessary for packaging targets like rpm-pkg, deb-pkg...
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| /linux/Documentation/driver-api/early-userspace/ |
| H A D | early_userspace_support.rst | 51 specified directory name will be mapped to '/'. When packaging a
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| /linux/ |
| H A D | README | 40 * Distribution Maintainer - Packaging kernels for distros
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| /linux/drivers/staging/media/deprecated/atmel/ |
| H A D | atmel-isc.h | 108 * @rlp_cfg_mode: Configuration of the RLP (rounding, limiting packaging)
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| /linux/Documentation/virt/hyperv/ |
| H A D | overview.rst | 184 Code Packaging
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| /linux/drivers/media/platform/microchip/ |
| H A D | microchip-isc.h | 109 * @rlp_cfg_mode: Configuration of the RLP (rounding, limiting packaging)
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| /linux/drivers/input/misc/ |
| H A D | bma150.c | 8 * The SMB380 is fully compatible with BMA150 and only differs in packaging.
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| /linux/Documentation/filesystems/ |
| H A D | ramfs-rootfs-initramfs.rst | 229 device) but the separate packaging of initrd (which is nice if you have
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| /linux/Documentation/admin-guide/RAS/ |
| H A D | main.rst | 337 packaging alternatives, like SO-DIMM, SIMM, etc. The UEFI
342 different kind of packaging.
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| /linux/Documentation/doc-guide/ |
| H A D | sphinx.rst | 132 Use OS packaging for Sphinx instead of Python virtual environment.
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| /linux/Documentation/scsi/ |
| H A D | BusLogic.rst | 277 retail kits. The BT- model numbers above refer to the bare board packaging.
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| /linux/scripts/ |
| H A D | Makefile.lib | 402 # This allows for packaging of a kernel and all devicetrees files, using
|