Documentation/networking/bonding.rst

28 multiple network interfaces into a single logical "bonded" interface.
50    3.1.2		Configuring Multiple Bonds with Sysconfig
53    3.2.2		Configuring Multiple Bonds with Initscripts
55    3.3.1		Configuring Multiple Bonds Manually
71    7.2	Configuring Multiple ARP Targets
85    11.2	High Availability in a Multiple Switch Topology
86    11.2.1		HA Bonding Mode Selection for Multiple Switch Topology
87    11.2.2		HA Link Monitoring for Multiple Switch Topology
93    12.2	Maximum Throughput in a Multiple Switch Topology
94    12.2.1		MT Bonding Mode Selection for Multiple Switch Topology
95    12.2.2		MT Link Monitoring for Multiple Switch Topology
309 	Specify these values in ddd.ddd.ddd.ddd format.  Multiple IP
375 	Validation is useful in network configurations in which multiple
379 	generated by the multiple bonding instances will fool the standard
429 	value should be a multiple of the miimon value; if not, it
430 	will be rounded down to the nearest multiple.  The default
490 		when multiple ports are programmed with the same MAC
743 	This delay should be a multiple of the link monitor interval
827 	should be a multiple of the miimon value; if not, it will be
828 	rounded down to the nearest multiple.  The default value is 0.
903 		traffic to a particular network peer to span multiple
905 		multiple slaves.
1052 Before editing, the file will contain multiple lines, and will look
1074 network configuration system will correctly start multiple instances
1120 system if you have multiple bonding devices.
1168 3.1.2 Configuring Multiple Bonds with Sysconfig
1172 handling multiple bonding devices.  All that is necessary is for each
1176 multiple bonding devices with identical parameters, create multiple
1257 is the proper syntax to specify multiple targets.  When specifying
1290 3.2.2 Configuring Multiple Bonds with Initscripts
1294 Enterprise Linux 5 support multiple bonding interfaces by simply
1298 not support this method for specifying multiple bonding interfaces; for
1299 those instances, see the "Configuring Multiple Bonds Manually" section,
1360 3.3.1 Configuring Multiple Bonds Manually
1363 This section contains information on configuring multiple
1365 initialization scripts lack support for configuring multiple bonds.
1367 If you require multiple bonding devices, but all with the same
1371 To create multiple bonding devices with differing options, it is
1376 provide multiple instances of bonding with differing options is to load
1377 the bonding driver multiple times.  Note that current versions of the
1383 To load multiple instances of the module, it is necessary to
1385 requires that every loaded module, even multiple instances of the same
1386 module, have a unique name).  This is accomplished by supplying multiple
1416 to configure multiple bonds with differing parameters (as they are older
1428 Use of the sysfs interface allows you to use multiple bonds
1430 It also allows you to use multiple, differently configured bonds when
1674 Any interface that needs a queue_id set should set it with multiple calls
1676 distributions that allow configuration via initscripts, multiple 'queue_id'
1935 7.2 Configuring Multiple ARP Targets
1945 Multiple ARP targets must be separated by commas as follows::
2183 connected via multiple physical links, then there is no availability
2193 11.2 High Availability in a Multiple Switch Topology
2196 With multiple switches, the configuration of bonding and the
2197 network changes dramatically.  In multiple switch topologies, there is
2216 switches (ISL, or inter switch link), and multiple ports connecting to
2220 11.2.1 HA Bonding Mode Selection for Multiple Switch Topology
2244 11.2.2 HA Link Monitoring Selection for Multiple Switch Topology
2255 In general, however, in a multiple switch topology, the ARP
2259 the ARP monitor should be configured with multiple targets (at least
2311 multiple physical links is, for purposes of configuring bonding, the
2357 	TCP/IP connection to stripe traffic across multiple
2456 	"local" network configuration, this mode balances multiple
2490 12.2 Maximum Throughput in a Multiple Switch Topology
2493 Multiple switches may be utilized to optimize for throughput
2516 performance, for example), using multiple smaller switches can be more
2525 12.2.1 MT Bonding Mode Selection for Multiple Switch Topology
2538 12.2.2 MT Link Monitoring for Multiple Switch Topology
2618 the interfaces attached to the bond may occupy multiple ports on a
2620 ports, the bond device receives multiple copies of the same packet
2688 multiple switch topology (one or more ESMs, zero or more PMs).  It is
2690 much like the example in "High Availability in a Multiple Switch